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Posted: Monday, October 9, 2017 10:02 PM


Job Description 13;
This is a highly visible role within the Order Fulfillment organization, which includes the end:to:end supply chain that encompasses Manufacturing Operations, Engineering and Technology Centers. You will support microcircuit assembly for New Product Introduction (NPI) initiatives from Keysights Electronic Industrial Solutions Group as well as the Communications Solutions Group. Together we address the complete wireless ecosystem, the aerospace and defense, automotive, energy, general electronics, manufacturing, and semiconductor businesses.

With a variety of mechanical, materials and programing oriented tasks, you will support the design, development, implementation and transfer of complex microelectronic and PCA manufacturing processes and products. You will work directly with mechanical and electronic designers, manufacturing engineers, technicians and customers across functions in the production of industry:leading RF, Microwave, mmWave and 5G Test and Measurement solutions. You will have the opportunity to influence the design of the microcircuits by providing DFx feedback, and you will enable next generation products through developing new processes and maintaining and improving existing processes. You will be the point of contact to communicate with R and D and Manufacturing partners in the US and worldwide. To strive in this role, you must be a strong communicator, exhibit technical leadership, and be a role model and mentor to other engineers.

Major responsibilities include:
:Develop gold wire, ribbon, mesh or flip chip bonding processes
:Perform manufacturing experiments; Interpret, analyze, and report results
:Design tooling for assembly processes and products using Creo 3D
:Create automated assembly programs for bonding
:Write and maintain procedure documentation
:Specify, select and qualify new equipment
:Troubleshoot existing bonding equipment
:Evaluate critical suppliers and their materials to ensure they meet requirements
:Analysis of nonconforming components or assemblies and provide corrective action solutions
:Occasional travel, less than 10
:Training, mentoring and consulting technicians and engineers across global sites 13;
Job Qualifications 13;
Required
Must have a minimum of 5:6 years of professional experience in microelectronics, specifically bonding.
BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science or other related fields, with a strong mechanical aptitude and hands:on approach.

: A proactive and flexible team player who can work with large and diverse groups
: Demonstrated track record of learning new concepts and theories
: Demonstrated leadership and ownership, strong teamwork, interpersonal skills and follow:thru
: Excellent written and verbal communication skills

Highly desired
Experience with
:Microcircuit assembly processes: epoxy dispense, component placement and wire bonding
:Automated, programmable equipment and machine tools
:Metallurgy, surface chemistry and electroplating
:Mechanics of materials
:Fabrication technologies including wafer fab and precision machining
:Design for Manufacturability
:Six Sigma and Lean principles
:Statistical Analysis, Statistical Process Control and Design of Experiments
:GD and T and CAD skills (PTC Creo Design and Drafting)
:MATLAB and Python
:Plasma, microwave plasma or RIE cleaning techniques
:Automated Optical Inspection
:Tolerance and thermal analysis of mechanical components and assemblies
:Metallic and non:metallic joining techniques: solder, epoxy and eutectic die attach 13;
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Privacy Statement
***Keysight is an Equal Opportunity Employer.***
Keysight Technologies Inc. is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gen

Source: https://www.tiptopjob.com/jobs/72225731_job.asp?source=backpage


• Location: North Bay

• Post ID: 82641397 northbay
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